China wholesale Bga Solder Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG

Short Description:

Product Detail

Product Tags

Feedback (2)

We always do the job to be a tangible group making sure that we can provide you with the top top quality as well as ideal value for Bismuth Tin Eutectic, Flux Core Solder Wire, Unleaded Tin Solder Bar Sn3.0ag0.5cu, The continual availability of significant grade merchandise in combination with our excellent pre- and after-sales support ensures strong competitiveness in an increasingly globalized market.

China wholesale Bga Solder Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:

Product Description

Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.

The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.

Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.

Application

The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.

Parameters

Spec	Sn96.5/Ag3.0/Cu0.5
Melting point	217℃
Specific Gravity	7.4g/cm³
Weight	450g/roll, 900g/roll, other weights can be customized

Features

1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.

2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness

3.The activated rosin flux in this product can offer superior fluxing effect.

Product Offerings

Alloy	Powder Size	Melting Point ℃	Description
Sn0.3Ag0.7Cu	T3、T4	217-227	High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed.
Sn1.0Ag0.5Cu	T3、T4	217-227
Sn3.0Ag0.5Cu	T3、T4	217-220
Sn35Bi0.3Ag	T3、T4	172	Mid-temp，Fast flowing solder
Sn35Bi1Ag	T3、T4	151-189
Sn42Bi58	T3、T4	138	Low melting point around 138℃Good wetting characteristics

Product detail pictures:

Related Product Guide:

As for competitive selling prices, we believe that you will be searching far and wide for anything that can beat us. We will state with absolute certainty that for such excellent at such charges we are the lowest around for China wholesale Bga Solder Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Estonia, Nairobi, Mali, Should any of these items be of interest to you, please let us know. We'll be satisfied to give you a quotation upon receipt of one's detailed specifications. We have our personal experienced R&D enginners to meet any of one's requriements, We appear forward to receiving your enquires soon'and hope to have the opportunity to work together with you in the future. Welcome to check out our company.

Easy Solder Paste