China wholesale Solder Preform with Flux and No Flux Suppliers – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG

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China wholesale Solder Preform with Flux and No Flux Suppliers – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG Detail:

SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.

Product Description

1. Properties before curing
Item	Parameter
Color	Red
Special gravity（25℃，g/cm^3）	1.3
Viscosity（25℃，10rpm，pa/s）	70
Thixotropic Index	105±10
Flash Point（TCC）	>95℃
Particle Size	15μm
Copper Mirror Test	No Corrosion

2. Properties after curing
Item	Parameter
Color	Red
Density(25℃)	1.3±0.1 g/cm^3
Coefficient of Thermal Expansion	25-70℃；51
Coefficient of Thermal Expansion	90-150℃；160
Volume Resistivity(25℃)	2.0*10^16 Ω/cm
Specific Heat	0.3 KJ/Kg.K
Glass Transition Temperature	105℃
Dielectric Constant	3.8 (100KHZ)
Dielectric Tangent	0.014 (100KHZ)
Shear Strength	24 n/m
Pull-out Strength	61 n
Torque Strength	52 n.mm

Curing Condition Test

The saved curing curve is shown below

The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below

In actual production process, the entire heating time is longer than the figure, because there is a preheating time.

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