China wholesale Solder Preform with Flux and No Flux Suppliers – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG
China wholesale Solder Preform with Flux and No Flux Suppliers – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG Detail:
SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
Product Description
SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
|
1. Properties before curing |
|
|
Item |
Parameter |
|
Color |
Red |
|
Special gravity（25℃，g/cm^3） |
1.3 |
|
Viscosity（25℃，10rpm，pa/s） |
70 |
|
Thixotropic Index |
105±10 |
|
Flash Point（TCC） |
>95℃ |
|
Particle Size |
15μm |
|
Copper Mirror Test |
No Corrosion |
|
2. Properties after curing |
|
|
Item |
Parameter |
|
Color |
Red |
|
Density(25℃) |
1.3±0.1 g/cm^3 |
|
Coefficient of Thermal Expansion |
25-70℃；51 |
|
90-150℃；160 |
|
|
Volume Resistivity(25℃) |
2.0*10^16 Ω/cm |
|
Specific Heat |
0.3 KJ/Kg.K |
|
Glass Transition Temperature |
105℃ |
|
Dielectric Constant |
3.8 (100KHZ) |
|
Dielectric Tangent |
0.014 (100KHZ) |
|
Shear Strength |
24 n/m |
|
Pull-out Strength |
61 n |
|
Torque Strength |
52 n.mm |
Curing Condition Test
The saved curing curve is shown below
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below
In actual production process, the entire heating time is longer than the figure, because there is a preheating time.
Product detail pictures:
Related Product Guide:
We provide good power in high-quality and progress,merchandising,revenue and internet marketing and operation for China wholesale Solder Preform with Flux and No Flux Suppliers – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG , The product will supply to all over the world, such as: Roman, Mexico, UAE, We supply professional service, prompt reply, timely delivery, excellent quality and best price to our customers. Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound products with good logistics service and economical cost. Depending on this, our products are sold very well in the countries in Africa, the Mid-East and Southeast Asia. Adhering to the business philosophy of ‘customer first, forge ahead', we sincerely welcome clients from at home and abroad to cooperate with us.
By Irma from Myanmar - 2018.12.11 11:26
We have been cooperated with this company for many years, the company always ensure timely delivery ,good quality and correct number, we are good partners.
By lucia from Slovakia - 2018.06.18 17:25
