China wholesale Solder Paste Material Manufacturer – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Solder Wire 0.8mm – QLG

Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products. Solid wire is also available.
The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.

Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.

Application

The Sn96.5Ag3.0Cu0.5 solder wire can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.

Parameters

Features

1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.

2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness

3.The activated rosin flux in this product can offer superior fluxing effect.

• Cored wire is standard with a 2% flux core. Other flux core %’s are available upon request.
• Cored wire is available in Sn/Pb, Sn/Ag/Cu, SN100 and other custom alloys upon request.
• These solder alloys are manufactured to meet the IPC J-STD-006 standard.
• Other flux percentages, alloys, diameters and spool sizes may be available upon special request